We don’t just sell PCBs. We sell sleep.
There are few parts in an electronic device that have such an impact on the final product as the printed circuit board. At first sight, PCBs differ little in appearance, irrespective of their inherent qualities. It is under the surface that we focus on the differences so critical to the PCBs’ durability and functionality. Customers cannot always see the difference, but they can rest assured that Cirtech EDA puts a great deal of effort into ensuring that their customers are supplied with PCBs that meet the most stringent quality standards.
The information below details some of the key capabilities that Cirtech EDA can offer and support today. You will find information here relating to the specific materials we can support, the PCB technologies or product types which we currently produce, as well as some of the tolerances which we can achieve.
The first category is what we call “standard” and means we can offer each individual parameters from multiple sources. The second is our “advanced” offering and this shows the very best that Cirtech EDA can offer, but here the supply chain or sourcing options are limited and in some cases this means that only one plant is capable of this parameter.
When using combinations of these parameters, you should always speak to one of our technical specialists.
|Materials||RIGID: FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance) including: ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUCFLEX: PI, PET including: Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. IMS: IMS Al based including: Bergquist MP, HT & CML, ITEQ T-Lam, Laird TLAM SS, Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Please contact NCAB Group for full details regarding material availability||RIGID: Mid – Loss material TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2 Low – Loss material N4000-13(series), FR408HR, Megtron-4, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20 (series), I-Speed Ultra Low – Loss material Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22 (series), RO4350B, RO3000 (series), RF-35, RF-35A2, TLX (series), AD250, FL-700LDFLEX: PI, LCP including: Dupont IMS: IMS Al & Cu based including: Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi Please contact NCAB Group for full details regarding material availability|
|Minimum dielectric thickness||0.075mm for PCB 0.025mm for FPC||≤0.05mm for PCB 0.015mm for FPC|
|Layer count||1 – 38L / 40L QTA||64L (pilot runs)|
|HDI / Buried – blind via||Y||Y|
|Copper filled BVH (Y/N)||Y||Y|
|Copper filled PTH (Y/N)||N||Y – copper paste|
|Copper paste filled PTH (Y/N)||N||Y|
|Capped via (Y/N)||Y||Y|
|Maximum board size (mm)||1000 x 580||1400 x 610|
|Minimum board thickness (mm) 2L||0.30 for PCB 0.05 for 1L FPC 0.12 for 2L FPC||0.20 for PCB 0.05 for 1L FPC 0.12 for 2L FPC|
|Minimum board thickness (mm) ≥4L||0.40 for PCB 0.20 for FPC||0.35 for PCB 0.16 for FCP|
|Maximum board thickness (mm)||7.0||10.0|
|Minimum track / gap IL (mil)- copper weight dependant||0.075mm||0.05mm|
|Minimum track / gap OL (mil)- copper weight dependant||0.075mm||0.05mm|
|Surface finish||ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG||ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF|
|Layer to layer registration||0.10mm||≤ 0.075mm|
|Minimum hole (mech) (mm/mil)||0.20mm||0.15mm|
|Minimum hole (laser) (mm/mil)||0.10mm||0.06mm|
|Aspect ratio PTH||10:1||20:1|
|Aspect ration BVH||0.8:1||1.3:1 (factory + design dependant)|
|Finish hole tolerance (PTH)||± 0.10mm||± 0.05mm|
|Finish hole tolerance (NPTH)||± 0.05mm||≤ ± 0.05mm|
|Maximum Cu weight OL||6oz (UL approved) 10oz (non-UL approved)||10oz|
|Maximum Cu weight IL||6oz (UL approved) 10oz (non-UL approved)||10oz|
|Controlled impedance (+/- X%)||Others ± 10%||± 5%|
|Rigid-flex (Y/N)||Y||Y including semi flex|
|IMS (Y/N)||Y (Al)||Y (both Al and Cu)|
|Embedded components (Y/N)||Y||Y|
|Soldermask via plugging IPC4761 Type VI (Y/N)||Y||Y|
|Epoxy via plugging IPC4761 Type VI (Y/N)||Y||Y|
|Epoxy via plugging IPC4761 Type VII (Y/N)||Y||Y|
|It is important to note that even with ‘standard’ technology this does not mean that all factories can achieve ALL of the aspects – When using combinations of these parameters, you should always consult your local Cirtech EDA technical contact person.|